FIELD: semiconductor equipment. SUBSTANCE: edge sections of strain-sensitive layer of samarium monosulfide are removed nonmechanically, in particular, by working in etching agent of following composition, in parts by volume: 1,0 part of concentrated hydrochloric acid per 650 parts of 5% of aqueous solution of thiocarbamide. EFFECT: facilitated manufacture. 2 cl, 2 dwg
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Authors
Dates
1995-03-27—Published
1991-05-30—Filed