FIELD: electronic technique, namely production of integrated circuits, procession of objects, coated by films, treatment of heavy aluminium parts. SUBSTANCE: method comprises steps of moving a discharge, had been created by direct current pulses, by action of superhigh frequency field relative to a surface of an object to be etched; creating the pulse discharge at one side of the object and applying an energy of superhigh frequency field at an opposite side and then vice versa in such a way, that to provide displacement of the discharge forwards and backwards relative to the object being etched; performing the etching process at atmospheric pressure or a pressure, being near to it. EFFECT: increased rate and enhanced uniformity of etching process. 1 tbl
Title | Year | Author | Number |
---|---|---|---|
REACTOR FOR PLASMA-CHEMICAL ETCHING OF SEMICONDUCTOR STRUCTURES | 2017 |
|
RU2678506C1 |
MODIFICATION METHOD OF MATERIAL SURFACE BY PLASMA TREATMENT | 2011 |
|
RU2478141C2 |
METHOD OF PLASMA ETCHING OF THIN FILMS | 1992 |
|
RU2029411C1 |
REACTOR FOR PLASMA-CHEMICAL TREATMENT OF SEMICONDUCTOR STRUCTURES | 2020 |
|
RU2753823C1 |
DEVICE FOR LOCAL PLASMA-CHEMICAL ETCHING OF SUBSTRATES | 2010 |
|
RU2451114C2 |
METHOD FOR PREPARING MAGNESIUM OXIDE-BASE PRODUCTS | 2005 |
|
RU2296105C1 |
METHOD AND DEVICE FOR GETTING STATIONARY COMBINED DISCHARGE OF LOW-PRESSURE LOW-TEMPERATURE PLASMA | 2004 |
|
RU2277763C2 |
METHOD FOR PLASMOCHEMICAL ETCHING OF SEMICONDUCTOR AND INSULATING MATERIALS | 2006 |
|
RU2316845C1 |
DEVICE FOR ION TREATMENT OF MATERIALS | 2000 |
|
RU2187168C1 |
METHOD FOR MICROPROFILING SUBSTRATE MATERIAL | 2000 |
|
RU2163409C1 |
Authors
Dates
1996-06-10—Published
1991-06-26—Filed