FIELD: microelectronics. SUBSTANCE: rectifying Schottky contacts are manufactured by annealing of crystal chemically cleaned in advance or of crystalline layer of silicon carbide in vacuum at temperature from 600 to 800 C for the course of 10 to 30 min. Aluminium is used as contact material which is deposited at temperature from 350 to 80 C. EFFECT: possibility of substitution of traditional metal of contact - gold with aluminium.
Title | Year | Author | Number |
---|---|---|---|
METHOD OF CONTROL OVER PROCESS OF WINNING OF SEMICONDUCTOR STRUCTURE | 2001 |
|
RU2188477C1 |
METHOD FOR MANUFACTURING OF INTEGRATED SCHOTTKY-pn DIODES BASED ON SILICON CARBIDE | 2009 |
|
RU2395868C1 |
METHOD OF MAGNIFIED IR BOUNDARY WAVE OF SCHOTTKY BARRIER DETECTOR, IR DETECTOR AND IR SENSITIVE PHOTODETECTOR ARRAY | 2006 |
|
RU2335823C2 |
HIGH-VOLTAGE POWER DIODE CRYSTAL WITH SCHOTTKY BARRIER AND P-N JUNCTIONS | 2023 |
|
RU2805563C1 |
SEMICONDUCTOR DEVICE AND METHOD OF ITS MANUFACTURING | 2012 |
|
RU2507634C1 |
PROCESS OF MANUFACTURE OF MICROMECHANICAL INSTRUMENTS | 1998 |
|
RU2137249C1 |
PROCESS OF MANUFACTURE OF CONTACTS OF INTEGRATED CIRCUITS BASED ON SILICON | 1992 |
|
RU2034364C1 |
SCHOTTKY-BARRIER PHOTODETECTOR MATRIX SENSITIVE IN SUB-MILLIMETER WAVEBAND | 2006 |
|
RU2304826C1 |
SEMICONDUCTOR ULTRAVIOLET-RADIATION SENSOR | 2001 |
|
RU2178601C1 |
METHOD TO MAKE HIGH VOLTAGE SILICON-CARBIDE DIODE BASED ON ION-DOPED P-N-STRUCTURES | 2013 |
|
RU2528554C1 |
Authors
Dates
1995-03-20—Published
1991-11-04—Filed