FIELD: microelectronics. SUBSTANCE: process of manufacture of semiconductor device includes extraction of active region of device on semiconductor structure, formation of ohmic contacts, application of dielectric layer on surface of structure, formation of metal mask with window for electrode of gate and subsequent anodizing of metal mask to diminish dimensions of window, etching of dielectric layer and formation of gate. EFFECT: facilitated manufacture. 9 dwg
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Authors
Dates
1995-03-20—Published
1992-03-04—Filed