FIELD: manufacture of semiconductor devices. SUBSTANCE: process consists in formation of layer of SiO2 on surface of silicon plate of p type of conductance with creation of built-in positive charge on separation boundary with inverted n-layer induced in zone close to surface of p-silicon and in manufacture of pair of ohmic contacts on formed structure. One contact is made to inverse n-layer by means of n+ region with subsequent sputtering of metal on n+ region, the other contact is produced by sputtering of metal on p-region from rear side of plate. First n+ region is formed on surface of plate by ion implantation of dope and sputtering of metal contact electrode on n+ region is performed through mask, then layer SiO2 is applied to zone limited by electrode. Application of layer is carried out at crystal temperature below 450 C. After this manufactured structure is subjected to X-ray radiation with D dose. Dose is selected from condition specified in description of invention. EFFECT: enhanced operational efficiency. 2 cl, 6 dwg
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Authors
Dates
1995-05-20—Published
1992-05-27—Filed