FIELD: manufacture of semiconductor devices built around thin films of amorphous siliocn. SUBSTANCE: method involves deposition of film onto heated substrate by decomposing gas mixture containing monosilane hydrogen, and gaseous ammonia in high-frequency glow-discharge plasma; ammonia content in mixture is 1-4 volume percent. EFFECT: high thermal stability of electrophysical and atructural characteristics of films produced, high adhesive properties of films.
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Authors
Dates
1996-05-27—Published
1993-02-04—Filed