FIELD: microelectronics. SUBSTANCE: method for selecting plates with radiation-resistant MOS integrated circuits during their production phase involves measurement of threshold voltages and input currents of integrated circuits before and after their exposure to X-rays of 10 keV. Then mean rate of change of threshold voltages of test transistors across Xipl plate and mean rate of change of voltages of test transistors across plate Xcr with critical parameters are determined, and plates with radiation-resistant integrated circuits are selected according to condition Xipl < Xcr. EFFECT: facilitated procedure. 1 dwg
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Authors
Dates
1997-06-20—Published
1995-03-21—Filed