FIELD: microelectronics. SUBSTANCE: digital devices and integrated circuits are formed on semiconductor substrate which is then thinned by chemical etching. Gettering layer is formed on underside of plate to ensure uniformetching, this procedure being followed by gettering baking which provides for reducing and ordering concentration of microdefects in plate volume. Pre-assembly operations include production of planar surface on rear side. EFFECT: improved quality of manufactured devices or integrated circuits. 6 cl, 5 dwg
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