FIELD: digital semiconductor devices and integrated circuits. SUBSTANCE: chip is deformed by applying mechanical load, then subjected to chemical etching with solution selectively acting on defects; prior to etching, chip is deformed by its ultrasonic treatment in chemically inactive liquid at 20-40 kHz for 10-30 min. EFFECT: improved sensitivity of selective chemical treatment to structural defects in chips. 2 tbl, 2 ex
