FIELD: electronic, atomic, optical and other branches of science and technology. SUBSTANCE: process of ion-plasma deposition of multicomponent film coats includes formation of orthogonal magnetic and electric fields in magnetron facility, sputtering of mosaic target containing inserts of heterogeneous metals and deposition of sputtered materials on backings anchored on anode. Target in which inserts are worked deeper and/or protrude relative to surface of other elements of target in erosion zone within bounds from 0.01 to 0.1 mm is utilized for sputtering. Total area of surface of inserts from each. material is proportional to concentration of element in coat. Sputtering is executed in balanced magnetron system with density of discharge power from 20 to 500 W/sq cm and residual induction from 0.03 to 0.1 T. Coat is deposited under steady-state condition with same linear rate of sputtering of materials of mosaic target. Mosaic target includes flat matrix anchored on cooled base and inserts of sputtered heterogeneous materials put on matrix and located uniformly in zone of target erosion along projections of lines of forces of magnetic field embedded and/or protruding relative to surface of other elements of target within limits from 0.01 to 0.1 mm. Total area of surface of inserts of each material is proportional to concentration of element in coat. Process of manufacture of target includes fabrication of elements of target and cooled base, assembly of target elements on base. Target is sputtered in balanced magnetron system with density of discharge in erosion zone from 20 to 500 W/sq cm and intensity of magnetic field from 0.03 to 0.1 T in the course of 15-30 min. EFFECT: formation of multicomponent films of specified composition under steady-state condition at high rate of sputtering. 14 cl, 5 dwg, 1 tbl
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Authors
Dates
2003-08-20—Published
2001-12-21—Filed