FIELD: microelectronics; metal deposition on glass-ceramic or polycoria substrates. SUBSTANCE: metal is deposited onto substrate in following sequence: cleaned substrate coated with resistive adhesive layer is placed in vacuum chamber wherein pressure is held at 4,8•10-6÷5,1•10-6 of mercury and vanadium layer is evaporated onto substrate until resistance of 190÷210 Ohm/□ is attained; then vanadium and copper are evaporated simultaneously for 15 to 25 s. After that copper and nickel are evaporated separately in succession up to thickness of 1 - 1.5 and 0.04 - 0.05 mcm, respectively. EFFECT: improved adhesion between substrate and evaporated metal coating. 1 cl
