FIELD: microelectronics. SUBSTANCE: invention is intended to increase quality of microcircuits thanks to enhanced adhesion of commutation layers to dielectric substance with simultaneous shortening of technological process which is achieved by protection of substrate surface with technological metal layer in process of formation of polyimide interlayer insulation. Process enable shortened cleaning cycle to be used for interoperational cleaning of substrate surface as substrate surface does not contact polyimide varnish immediately besides sections of interlevel crossing of conductors. EFFECT: increased quality of microcircuits. 18 dwg
| Title | Year | Author | Number |
|---|---|---|---|
| PROCESS OF MANUFACTURE OF THIN-FILM MICROCIRCUITS | 1991 |
|
RU2040131C1 |
| METHOD FOR MANUFACTURING OF MICROCIRCUIT BOARDS WITH MULTI-LEVEL THIN-FILM COMMUTATION | 2009 |
|
RU2398369C1 |
| METHOD OF MAKING THIN-FILM MULTILEVEL BOARDS FOR MULTICHIP MODULES, HYBRID INTEGRATED CIRCUITS AND CHIP ASSEMBLIES | 2011 |
|
RU2459314C1 |
| METHOD FOR PRODUCING MULTILEVEL THIN-FILM INTEGRATED CIRCUITS | 2004 |
|
RU2264676C1 |
| METHOD OF MAKING MULTILEVEL COMMUTATION OF INTEGRATED CIRCUITS | 1992 |
|
RU2017353C1 |
| METHOD OF PRODUCING MULTILAYER RADIOELECTRONIC COMPONENTS | 2023 |
|
RU2826900C1 |
| METHOD FOR PRODUCING MULTILAYER PRINTED-CIRCUIT BOARDS | 1991 |
|
RU2072123C1 |
| METHOD FOR MANUFACTURING THIN-FILM STRUCTURE OF MICROWAVE HYBRID INTEGRATED CIRCUIT | 2005 |
|
RU2293400C1 |
| METHOD OF MAKING MAGNETORESISTIVE SENSOR | 2011 |
|
RU2463688C1 |
| METHOD TO MANUFACTURE MULTI-LEVEL THIN-FILM MICROCIRCUIT CHIPS | 2011 |
|
RU2474004C1 |
