FIELD: semiconductor electronics. SUBSTANCE: proposed transistor is characterized in that mean area of insulated metallization fragments of contact pads of emitter and base zones in each transistor module reduces with increase in inductance of its output circuit. In this case additional condition is no increase in total surface area of insulated metallization fragments of this module relative to modules having lower inductances of output circuits. Provision is made to compensate for differences in inductances of output circuits due to respective difference in capacitances of these output circuits. EFFECT: reduced nonuniformity of resonant frequencies of output circuits in separate transistor cells; enhanced transistor power gain. 1 cl, 3 dwg
Title | Year | Author | Number |
---|---|---|---|
HIGH-POWER MICROWAVE TRANSISTOR | 2003 |
|
RU2227946C1 |
POWERFUL UHF TRANSISTOR | 2003 |
|
RU2253924C1 |
POWERFUL HIGH-FREQUENCY AND SUPER HIGH-FREQUENCY TRANSISTOR | 2006 |
|
RU2328058C1 |
HIGH-POWER BROADBAND HIGH-FREQUENCY AND MICROWAVE TRANSISTOR | 2001 |
|
RU2192692C1 |
HIGH-POWER RADIO-WAVE AND MICROWAVE TRANSISTOR | 2001 |
|
RU2190899C1 |
POWERFUL HIGH-FREQUENCY AND SUPER HIGH-FREQUENCY BROADBAND TRANSISTOR | 2009 |
|
RU2402836C1 |
HEAVY-POWER MICROWAVE TRANSISTOR | 2002 |
|
RU2216073C1 |
POWERFUL HIGH-FREQUENCY AND SUPER HIGH-FREQUENCY BALANCE TRANSISTOR | 2006 |
|
RU2328057C1 |
HIGH-POWER RF AND MICROWAVE TRANSISTOR | 2009 |
|
RU2403650C1 |
POWERFUL MICROWAVE TRANSISTOR | 2021 |
|
RU2763387C1 |
Authors
Dates
2004-04-27—Published
2003-01-04—Filed