METHOD FOR PRODUCING PRINTHEAD INTERCONNECTION STRUCTURE INCORPORATING THIN-FILM RESISTOR Russian patent published in 2005 - IPC

FIELD: ink-jet printers and their printheads having small holes for programmable ejection of ink droplets.

SUBSTANCE: proposed method for producing printhead thin-film interconnection structure includes deposition of resistor layer and conductor layer onto insulated substrate, formation of patterns of layers deposited onto insulated structure to form resistive heating element, formation of insulating barrier layer onto pattern of mentioned conductor layer, formation of window in mentioned barrier layer, production of metal layer contacting mentioned conductor layer pattern through mentioned window whose geometry opens up predetermined area of mentioned conductor layer pattern, and metal layer pads on insulating barrier layer above heating layer; prior to arrangement of conductors from metal layer, insulating barrier layer is treated with etching solution for cleaning and recovering surface insulating barrier layer, and along with wiring of metal layer from mentioned conductor layer pattern through mentioned window in insulating barrier layer on adjacent area of mentioned insulated substrate metal layer wiring section is made in the form of pad on insulating barrier layer above heating element used as stabilizing evaporation surface. In this way insulating barrier layer is cleaned and its properties are recovered, metal layer wiring adhesion to insulating barrier layer, and especially adhesion of metal layer pad to insulating barrier layer above heating element, is enhanced.

EFFECT: enhanced quality and reliability of printhead.

3 cl, 11 dwg