FIELD: quantum electronics; semiconductor laser manufacture.
SUBSTANCE: applied to n-GaAs substrate in layer-by-layer manner are bottom n-Alz1Ga1 - z1As layer of shell, bottom light-guide n- or i-In0.49Ga0.51P layer, active Inx3Ga1 - y3Py3 layer with quantum well, top first light-guide i-In0.49Ga0.51P layer, sealing GaAs layer, and SiO2 layer. Then SiO2 film portion of about 20 μm in width is removed. When SiO2 film is used as mask, sealing layer disposed close to butt-end surface and first top light-guide layer are removed. After that SiO2 film, active layer with quantum well disposed close to butt-end surface, and remaining sealing layer are removed. Top p-Alz1Ga1 - z1As layer of shell and p-GaAs contact layer are deposited on second top p- or i-In0.49Ga0.51P layer. Laser radiation is generated in wavelength range of 0.7 - 1.2 μm.
EFFECT: enhanced operating reliability of laser unit at heavy output power.
19 cl, 10 dwg
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Authors
Dates
2006-03-20—Published
2001-08-09—Filed