FIELD: microelectronic and micro-mechanic devices, possibly used as flow-rate meters, liquid or gas level change pickups.
SUBSTANCE: pickup has chip with additional through holes. On surface of holes dielectric layer is applied and said layer is coated with metallic layer. On reverse side of chip there are additional contact lands for seating chip by eutectics. Said additional contact lands are connected through metallic layer in holes with main contact lands. On main and additional contact lands and in through holes metallic layer is applied at one cycle onto both surfaces of base frame by angle 45 - 60° relative to surface of base frame in order to eliminate rupture of plated metal along boundaries of holes.
EFFECT: improved operational reliability of pickup.
2 dwg
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Authors
Dates
2007-01-10—Published
2004-08-30—Filed