INSTALLATION FOR THE VACUUM IONIC-PLASMA TREATMENT OF THE SURFACES Russian patent published in 2007 - IPC C23C14/34 C23C14/56 

Abstract RU 2294395 C2

FIELD: chemical industry; other industries; devices for deposition of the vacuum ionic-plasma coatings on the surfaces of the machines components and materials.

SUBSTANCE: the invention is pertaining to the installations for deposition of the vacuum ionic-plasma coatings on the surfaces of the machines components and materials, in more particular, to the vacuum ionic-plasma treatment of the surfaces, and may be used in the equipment for deposition of the coatings on the products made out of the metals and alloys, dielectrics and other materials. The installation for the vacuum ionic-plasma treatment of the surfaces includes the vacuum chamber, the plasma sources, the system of vacuumization, the system of feeding and control over the gas consumption, the power supply and the control unit. The chamber has the openings with the covers hermetically coupled with the chamber and carrying the plasma sources. The plasma sources are made in the form of the technological modules including the technological blocks, the set composition of which ensures fulfillment of the preset operational cycle. The covers are made out in the form of the flanges mounted on the rotary frames pivotally mounted and fixed on the body of the chamber. Such design of the installation ensures the treatment of the complex spatial details or the great number of the details arranged in the vacuum chamber with the high quality of the coatings.

EFFECT: the invention ensures the treatment of the complex spatial details or the great number of the details arranged in the vacuum chamber with the ensured high quality of the coatings.

3 cl, 5 dwg

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RU 2 294 395 C2

Authors

Petrov Leonid Mikhajlovich

Plikhunov Vitalij Valentinovich

Matveev Nikolaj Valentinovich

Gavrilov Aleksandr Sergeevich

Ivanchuk Svetlana Borisovna

Nikonorov Aleksandr Nikolaevich

Arkusskij Leonid Jul'Evich

Dates

2007-02-27Published

2005-04-29Filed