FIELD: manufacture of infrared photodetector around chemically deposited lead sulfide using different number of photosensitive components.
SUBSTANCE: proposed method for assembling photodetectors built around lead sulfide by way of polymeric sealing includes covering of photosensitive components with inorganic shielding coat followed by assembling optical parts on their surfaces; after that photosensitive component is sealed by applying polyorganosiloxane urethane based polymeric adhesive sealing materials onto its surface and organic components are glued. Different adhesive sealing compounds are applied to single-components photodetectors operating at temperatures of +50 to -60 °C and for multicomponent ones incorporating 64 to 256 components and operating at temperatures of +50 to -196 °C. Proposed method does not produce detrimental impact onto photoelectric parameters of components being sealed during assembly process.
EFFECT: enhanced reliability of shielding components, even of those unpackaged, under all operating conditions.
1 cl, 1 dwg
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Authors
Dates
2007-10-20—Published
2006-03-31—Filed