FIELD: measuring technique.
SUBSTANCE: three-dimensional structure and method of its production can be applied to scanning probe microscope, oscillations measuring devices, surface and border surface analyzer of electric circuit, mass detector, electric circuit network, filter for gripping material an so on and it can be used for measurement of temperature, determination of temperature distribution in electron devices and temperature distribution and metabolism in biological matters. Three-dimensional structure is formed by high-reliable super-thin silicon wires having size of 1 nanometer to several micrometers, formed by wet etching by usage of crystal structure of single-crystal material. Two wires form one thin coil.
EFFECT: improved reliability of measurements.
29 cl, 31 dwg
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