METHOD FOR DETERMINING THERMAL RESISTANCE OF DIGITAL INTEGRATED MICROCIRCUITS Russian patent published in 2008 - IPC G01R31/317 

Abstract RU 2327177 C1

FIELD: physics.

SUBSTANCE: invention pertains to control of quality of digital integrated microcircuits based on TTL and Schottky logic elements. The microcircuit is heated by the load current during switching on of the logic status of one of the logic elements. The heating power is determined. On the chosen logic element, used as a temperature sensor, a high-level voltage is applied at the output. Variation of the high-level voltage is due to the presence of a thermal contact and due to the undesired electrical component. The alternating component of variation of the high-level voltage of the temperature sensor is separated. Positive and negative voltage is detected. The negative voltage is inverted and summed with the positive voltage. The obtained signal depends on thermal contact. The amplitude of the obtained periodic signal is measured and using the voltmeter, the first harmonic is measured. The maximum change in the high-level voltage of the logic element used as the temperature sensor is determined. Thermal resistance is determined from a known formula.

EFFECT: elimination of effects of the electrical component on the result of determining thermal resistance.

2 dwg

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RU 2 327 177 C1

Authors

Judin Viktor Vasil'Evich

Sergeev Vjacheslav Andreevich

Dates

2008-06-20Published

2007-01-09Filed