METHOD OF MULTI-LAYER THIN-FILM STRUCTURE MANUFACTURING Russian patent published in 2008 - IPC H05K3/14 H05K3/46 

FIELD: electrical engineering.

SUBSTANCE: method consists in application of adhesive layer material on base by means of spraying in oxygen medium and further application in vacuum material of conducting layer and layer of material that possesses the ability to soldering with low temperature solders, at that adhesive layer material spraying is first done in oxygen medium at pressure of (1.3-13)-10^-1 Pa until 1/2_{of adhesive layer film thickness is obtained, and completion of adhesive layer spraying is done in vacuum with pressure of (1-5)-10^-3 Pa.}

EFFECT: allows to increase adhesive strength between adhesive and conducting layers of metallised structure.

1 dwg