FIELD: metallurgy.
SUBSTANCE: invention relates to plasma technology, particularly to dual magnetron spray-type system and can be used for application of thin films of metals and its compounds in different field of technologies. Dual magnetron spray-type system contains located in one plane nearby each other two planar magnetrons, each of which contains casing, magnetic system and flat plate target, and feed system with changed polarity. Both magnetrons are located in additional total casing insulated from it. Between planar magnetron it is located additional magnetic system, polarity of which coincide with polarity of central magnet of magnetic system of each magnetron. Magnetrons are connected to feed system with changeable polarity so, that at the same moment of time voltage sign on magnetrons is opposite.
EFFECT: development of effective dual magnetron spray-type system.
2 dwg
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