FIELD: physics.
SUBSTANCE: method of diffusing phosphorous from phosphorous-silicate films involves formation of phosphosilicate glass on the surface of a silicon wafer from a gas phase. The diffusant source used is liquid source of phosphorous oxychloride (POCl3) with the following ratio of components: oxygen - O2=38 l/h nitrogen - N2=700 l/h, nitrogen through feeder - N2=36.7 l/h at operating temperature of 1000°C, time for predeposition of phosphorous - 40 minutes, surface resistance RS=160±10 Ohm/cm.
EFFECT: reduced spread of surface concentration values on the entire surface of the silicon wafer, shorter duration and lower temperature of the process.
3 ex
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Authors
Dates
2009-10-27—Published
2008-07-17—Filed