FIELD: physics.
SUBSTANCE: phosphorus diffusion method includes forming phosphosilicate glass on the surface of a silicon wafer. The diffusion source used is phosphorus nitride. The process is carried out at the following gas flow rates: O2=70 l/h, nitrogen N2=700 l/h, at temperature of 1020°C and the process is carried out for 30 minutes. The process is monitored by measuring surface resistance (RS). The surface resistance RS=155±5 ohm/cm.
EFFECT: obtaining uniform surface concentration on the entire surface of a silicon wafer and short process.
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Authors
Dates
2014-07-27—Published
2013-01-10—Filed