FIELD: process engineering.
SUBSTANCE: invention relates to semiconductor technology and production of high-power silicon transistors, particularly, to making of transistor source area. In compliance with claimed process, diffusion is effected with the help of solid planar phosphorus source at phosphorus spin-on step at 1125°C for 40 minutes at the following ratio of components: O2 - 40±0.5 l/h, N2 - 750 l/h, H2 - 8 l/h. at phosphorus drive-in step, it is performed at 1250°C and the following low rate of components: O2 - 40±0.5 l/h and nitrogen N2 - 750 l/h, cycle making 72 h.
EFFECT: optimised process, lower process temperature and decreased cycle, precise control over alloying ply depth, higher yield.
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Authors
Dates
2015-11-10—Published
2014-01-31—Filed