FIELD: chemistry.
SUBSTANCE: silicon wafers are loaded into a quartz tray which is placed in a pipe located inside a heated single-zone furnace SDOM-3/100. A stream of carrier gas - hydrogen (H2) - is passed through the pipe. Phosphorus anhydride (P2O5) is placed in the source area and heated to temperature of 300°C at which the source evaporates. The process is carried out at the following gas flow rates: O2=40 l/h, nitrogen N2=500 l/h.
EFFECT: carrying out a phosphorus diffusion process using a solid diffusion source, reduced spread of values of surface concentration on the entire surface of the silicon wafer and short duration and low temperature of the process.
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Authors
Dates
2014-07-27—Published
2013-01-09—Filed