FIELD: information technology.
SUBSTANCE: flash memory element for electrically reprogrammable read-only memory has a semiconductor substrate with on which there is a source and a drain, and tunneling layer, a memory layer, a blocking layer and conducting gate are made in series between the source and the drain. The memory layer is made as component of a sublayer of silicon nitride with a surface region containing excess silicon, which gives rise to presence of surface traps, wherein the memory layer has thickness which enables domination of said traps in the storage medium.
EFFECT: more reliable information storage at high temperature conditions (up to 85°C).
9 cl, 2 dwg
Title | Year | Author | Number |
---|---|---|---|
FLASH MEMORY ELEMENT FOR ELECTRICALLY PROGRAMMABLE READ-ONLY MEMORY | 2008 |
|
RU2381575C1 |
FLASH MEMORY ELEMENT FOR ELECTRICALLY PROGRAMMABLE READ-ONLY MEMORY | 2009 |
|
RU2402083C1 |
FLASH ELEMENT OF MEMORY | 2013 |
|
RU2546201C2 |
FLASH MEMORY ELEMENT FOR ELECTRICALLY PROGRAMMABLE READ-ONLY MEMORY | 2008 |
|
RU2357324C1 |
FLASH MEMORY ELEMENT OF ELECTRICALLY ALTERABLE READ-ONLY MEMORY | 2008 |
|
RU2368037C1 |
FLASH MEMORY ELEMENT OF AN ELECTRICALLY REPROGRAMMABLE PERMANENT MEMORY DEVICE | 2006 |
|
RU2310929C1 |
MEMORY ELEMENT FOR ELECTRICALLY ERASABLE PROGRAMMABLE READ-ONLY MEMORY | 2005 |
|
RU2287865C1 |
FLASH MEMORY ELEMENT FOR ELECTRICALLY PROGRAMMABLE READ-ONLY MEMORY | 2015 |
|
RU2584728C1 |
METHOD OF PRODUCTION OF ACTIVE LAYER FOR GENERAL-PURPOSE MEMORY ON BASIS OF RESISTIVE EFFECT | 2015 |
|
RU2611580C1 |
METAL-DIELECTRIC-SEMICONDUCTOR STRUCTURE BASED ON AB COMPOUNDS AND ITS FORMATION METHOD | 2010 |
|
RU2420828C1 |
Authors
Dates
2010-11-10—Published
2009-07-20—Filed