FIELD: electricity.
SUBSTANCE: method of production of the active layer for the general-purpose memory on the basis of resistive effect includes deposition of the dielectric layer - hafnium oxide - on the underlay. As a result of deposition, hafnium oxide of non-stoichiometric composition is obtained - HfOx, containing oxygen vacancies. The deposition is carried out by ion beam sputtering-deposition of Hf target in the oxygen-containing atmosphere. At the same time, stoichiometric composition x is set with partial oxygen pressure of x<2. The value of pressure is selected within the range from 2×10-4 Pa to 1×10-2 Pa, including the above values.
EFFECT: appearance of the hysteresis window on current-voltage characteristic of the resistance element, obtaining a reversible resistive switching without performing the forming process, and preventing a possible failure of the memory element in the preparatory phase of the work.
5 cl, 2 dwg
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Authors
Dates
2017-02-28—Published
2015-11-02—Filed