FIELD: chemistry.
SUBSTANCE: in the method of making indium columns, a plate with metal contacts is successively coated with a first layer of photoresist, a first metallic layer, a second layer of photoresist and a second metallic layer. Photolithographic processing is then carried out under the In column with etching of the second metallic layer. The second layer of photoresist is exposed to UV radiation and developed to obtain a negative angle to the first metallic layer. The first metallic layer and the first layer of photoresist are etched to the top surface of the metal contacts. An In film is sputtered onto the plate. The second layer of photoresist with the indium metallic film removed. The first metallic layer is etched and the first layer of photoresist is dissolved.
EFFECT: simple environmentally safe technology.
12 dwg
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