FIELD: electricity.
SUBSTANCE: in the method to make powerful high-voltage silicon devices, including development of a semiconductor structure, comprising a blocking p+N-transition, by means of thermal diffusion of admixtures into silicon of N-type conductivity, which create layers of p+ and n+-type conductivity, applying ohmic contacts structure onto the surface, its radiation at the side of the specified p+N-transition with the energy of 350÷550 keV and an appropriate dose of 5·1017 cm-2 ÷ 1·1016 cm-2, and radiation of this structure at any side by electrons with the energy of 1÷10 MeV and dose F, determined from the stated ratio.
EFFECT: invention provides for manufacturing of powerful high-voltage semiconductor silicon devices with low losses of capacity during their operation, cheapening and acceleration of the technological manufacturing process.
5 ex
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Authors
Dates
2011-11-27—Published
2010-07-28—Filed