FIELD: vacuum engineering; vacuum deposition of films. SUBSTANCE: proposed method includes forming electron beam, acting on this beam by accelerating voltage, evaporation of target material by electron beam and its deposition on substrate; target material is subjected to additional cooling by directional thermal radiation. Device proposed for realization of this method has thermionic cathode, screen, power supply source and cylindrical heating element located coaxially relative to rod made from sublimated material and connected with this rod and with positive terminal of power supply source. EFFECT: improved quality of films; increased rate of evaporation. 3 cl, 1 dwg
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Authors
Dates
2002-09-27—Published
2000-07-13—Filed