METHOD OF CUTTING OF OSCILLATING PART Russian patent published in 2014 - IPC B23B1/00 

Abstract RU 2510311 C1

FIELD: process engineering.

SUBSTANCE: proposed method comprises relative displacement of part and cutting tool and feed of coolant-lubricant subjected to vibration effects to cutting zone on cutting tool face surface. To decrease cutting forces and to increase dynamic stiffness, said cutting tool is additionally equipped with extra oscillating plate making an extension of cutting plate face surface which is subjected to oscillations at 1 kHz-40 kHz. Note here that chip flow is directed to the surface of said extra oscillating plate. Note also that coolant-lubricant flow and chip flow are subjected to oscillations in said frequency range while said coolant-lubricant flow by free spray.

EFFECT: higher cutting forces and dynamic stiffness.

1 dwg

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RU 2 510 311 C1

Authors

Kozochkin Mikhail Pavlovich

Sabirov Fan Sagirovich

Kochetov Oleg Savel'Evich

Kajmin Vjacheslav Gennad'Evich

Dates

2014-03-27Published

2013-01-25Filed