FIELD: electrical engineering.
SUBSTANCE: invention relates to the field of semiconductor microelectronics, namely to an assembly technology of semiconductor devices, and can be used to hybridize reading LSI chips and the photosensitive element matrix (PSEM) by inverted mounting. To determine the quality of docking, an allowable gap between the crystals is calculated, a real gap between them is measured and they are compared. In this case, if the measured gap is greater than the calculated one, then the crystals are directed to an additional press to reduce the gap, if the measured gap is less than the calculated gap, the docking is considered satisfactory.
EFFECT: invention provides an improvement in the quality of the on-line inspection of crystal docking.
1 cl, 4 dwg
Title | Year | Author | Number |
---|---|---|---|
METHOD TO INCREASE ACCURACY OF DOCKING QUALITY CONTROL | 2018 |
|
RU2686882C1 |
METHOD FOR QUALITY CONTROL OF GROUP DOCKING OF CRYSTALS | 2023 |
|
RU2819153C1 |
MULTICHIP POLYCHROMATIC PHOTO RECEIVER (PR) WITH EXPANDED SPECTRAL RESPONSE OF QUANTUM EFFICIENCY | 2014 |
|
RU2564813C1 |
METHOD FOR HYBRIDISATION OF READING LSI CHIPS AND PHOTOSENSITIVE ELEMENT ARRAY OF PHOTODETECTOR DEVICES | 2013 |
|
RU2537089C1 |
METHOD FOR FORMATION OF MATRIX MICROCONTACT ELEMENTS | 2017 |
|
RU2654944C1 |
METHOD FOR INCREASING DOCKING STRENGTH OF CRYSTALS | 2015 |
|
RU2613617C2 |
METHOD OF ASSEMBLING INFRARED PHOTODETECTOR | 2013 |
|
RU2526489C1 |
METHOD FOR MANUFACTURING MICROCONTACTS | 2017 |
|
RU2655953C1 |
METHOD OF MAKING PHOTODETECTOR ARRAY | 2014 |
|
RU2573714C1 |
METHOD OF MANUFACTURING THINNED TWO-SPECTRAL PHOTOSENSITIVE ASSEMBLY | 2017 |
|
RU2676052C1 |
Authors
Dates
2018-07-04—Published
2017-06-05—Filed