FIELD: physics.
SUBSTANCE: invention relates to a method of providing a protective, passivation or sealing layer on an organic electronic device or a component thereof by depositing weakly accelerated particles by sputtering a beam of ions or plasma or by direct deposition of a beam of ions or plasma. The method is characterised by that the organic electronic device or component thereof is exposed to a beam of particles with predominant particle energy from 0.1 eV to 30 eV, thereby depositing a layer of said particles on the electronic device or component thereof. The invention also relates to a method of sealing an organic electronic device, a protective layer and an organic electronic device having said layer.
EFFECT: present invention provides a layer which does not damage an organic layer and has no or negligible negative impact on characteristics of the device.
16 cl, 2 tbl, 3 ex, 5 dwg
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