SEMICONDUCTOR CHEMICAL ETCHING METHOD Russian patent published in 2014 - IPC H01L21/311 

Abstract RU 2524137 C1

FIELD: chemistry.

SUBSTANCE: chemical etching of a semiconductor surface is carried out in an etching agent consisting of the following components: hydrofluoric acid (HF), nitric acid (HNO3) and acetic acid (CH3COOH) in ratio of 1:6:3.

EFFECT: complete removal of the oxide formed on the surface of semiconductors and faster treatment.

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RU 2 524 137 C1

Authors

Ismailov Tagir Abdurashidovich

Shangereeva Bijke Alievna

Shangereeva Sujkum Alievna

Dates

2014-07-27Published

2013-01-10Filed