FIELD: chemistry.
SUBSTANCE: chemical etching of a semiconductor surface is carried out in an etching agent consisting of the following components: hydrofluoric acid (HF), nitric acid (HNO3) and acetic acid (CH3COOH) in ratio of 1:6:3.
EFFECT: complete removal of the oxide formed on the surface of semiconductors and faster treatment.
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Authors
Dates
2014-07-27—Published
2013-01-10—Filed