FIELD: electrical engineering.
SUBSTANCE: invention relates to a technology of manufacture of silicon transistors, in particular to methods for treatment of a backside before spraying. The method for treatment of a surface of plates before spraying of titanium-germanium (Ti-Ge) includes treatment of the surface of silicon plates before spraying on the backside of the plate, the treatment is carried out by etching, while, as an etchant, a solution is used, which includes: nitric acid – HNO3, hydrofluoric acid – HF, deionized water – H2O, at the following ratios: HNO3:HF:H2O – 1:10:35, and time of the treatment of the surface of silicon plates at a room temperature is no more than 25±5 s.
EFFECT: invention provides complete removal of oxide residues from a surface of a backside of silicon plates before spraying, and reduction in a temperature of treatment.
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Authors
Dates
2022-12-20—Published
2020-12-17—Filed