FIELD: electricity.
SUBSTANCE: method of making a micromechanical element includes forming, on a silicon substrate (1), a process membrane (2), protrusions (3), a working membrane (5), a microrelief (4), a highly doped n+ surface layer (6) and insulation (7) via photolithography, forming a metal shunt (8) by depositing gold on a tungsten sublayer and forming a movable electrode in the form of an arm with flexible supporting beams via end-to-end plasma-chemical etching of slotted openings (9) in the working membrane, and making a metal printed-circuit board (10), power buses (11), a lower electrode (12) and a frame for an upper electrode (13), followed by connection of the micromechanical element and the metal printed-circuit board using a conductive adhesive.
EFFECT: providing a given gap between the movable structure of a silicon chip and a printed-circuit board, thereby providing an optimum ratio between the value of control voltage and rigidity of the movable structure of the silicon chip.
5 cl, 9 dwg
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Authors
Dates
2014-09-10—Published
2013-11-05—Filed