FIELD: electricity.
SUBSTANCE: method to manufacture semiconductor device isolations involves formation of a highly doped p+ zone inside a p-well at its edge by the implantation of boron ions with the energy of 100-120 keV, concentration of 1.6·1018 cm-3 with the following annealing under the temperature of 400-500°C during 30 minutes.
EFFECT: increased breakdown voltage of semiconductor device isolations, improved fabricability, quality and percentage yield of serviceable devices.
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Authors
Dates
2014-09-20—Published
2013-03-12—Filed