FIELD: physics.
SUBSTANCE: light-emitting diode (LED) comprises a base, a light-emitting structure, a first electrode and a second electrode. An U-shaped electroconductive suspension for the light-emitting structure, which is transparent for the emitted light, is made on the base. The suspension lies on the base with one arm and is rigidly connected to the base. There is a series of elements rigidly connected to the arms between the arms in the direction from the base. The elements comprise an insulating layer, a first electrode, a layer which acts a mirror and a heatsink and a light-emitting structure. The LED is made as follows. A multilayer film element is formed on the base. The materials used are such that the layer geometry and intrinsic mechanical stress thereof enable to obtain a light-emitting structure and U-shaped suspension which is electroconductive and transparent for the emitted light. The step of forming the film element includes successively making a set of layers with intrinsic mechanical stress and a set of layers of the light-emitting structure. For the latter, two areas are formed, which are arranged with a gap with a depth to the last set of layers with intrinsic mechanical stress. Areas of the film element are obtained - an area which corresponds to the arm lying on the base, an area which corresponds to the arm connected to the light-emitting structure and an area corresponding to a loop. An insulating layer, on which the first electrode is made, is formed on the area of the film element which corresponds to the arm lying on the base. A layer which acts the mirror and heatsink is formed on the area of the film element which corresponds to the arm connected to the light-emitting structure. The film element is then partially separated from the base, leaving it connected on the area which corresponds to the arm lying on the base. The set of layers with intrinsic mechanical stress is transformed under the action of the intrinsic mechanical stress into U-shaped suspension with a loop and the obtained light-emitting structure between the arms. During separation, the set of layers of the light-emitting structure with the layer which acts as a mirror and a heatsink is turned over and the latter is brought into contact with the first electrode to form a rigid connection.
EFFECT: high efficiency of converting electrical energy into light energy and heat removal, reducing the dimensions of LEDs and integration with other optoelectronic devices on a single base.
21 cl, 6 dwg
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Authors
Dates
2015-06-20—Published
2014-03-05—Filed