FIELD: test hardware.
SUBSTANCE: claimed process consists in accelerated testing of metallic conductors at constant temperature by self-heating by flowing current. Metal conductor resistance build-up rate is defined for time in flat area. Note here that metal conductor fault tests are not performed.
EFFECT: accelerated tests, higher validity.
3 tbl, 9 dwg
| Title | Year | Author | Number |
|---|---|---|---|
| METHOD FOR ASSESSMENT OF ELECTROMIGRATION PARAMETERS IN METAL CONDUCTORS | 2014 |
|
RU2567016C1 |
| INTEGRAL TEST STRUCTURE TO ASSESS RELIABILITY AND METALLISATION | 2011 |
|
RU2460169C1 |
| MANUFACTURING METHOD OF MULTI-LEVEL COPPER METALLISATION OF VLSIC | 2010 |
|
RU2420827C1 |
| METHOD OF CONTROLLING METAL COATING QUALITY | 2008 |
|
RU2383080C1 |
| METHOD FOR MANUFACTURING OF MULTILEVEL COPPER METALLISATION WITH ULTRALOW VALUE OF DIELECTRIC CONSTANT FOR INTRALAYER INSULATION | 2013 |
|
RU2548523C1 |
| COMPONENT INTERCONNECTION | 1990 |
|
SU1825236A1 |
| METHOD OF MAKING SYSTEM FOR METAL PLATING SILICON SEMICONDUCTOR DEVICES | 2006 |
|
RU2333568C1 |
| TWO-ELECTRODE TEM STRIP LINE WITH VARIABLE DIMENSIONS AND TUNABLE LOAD AND MATCHING DEVICE | 2019 |
|
RU2722409C1 |
| METHOD OF TREATMENT OF SURFACE NANOSTRUCTURES | 2012 |
|
RU2492135C1 |
| METALLIZATION QUALITY CONTROL METHOD | 1983 |
|
SU1152449A1 |
