METHOD OF MANUFACTURING THINNED TWO-SPECTRAL PHOTOSENSITIVE ASSEMBLY Russian patent published in 2018 - IPC H01L31/18 

FIELD: manufacturing technology.

SUBSTANCE: invention relates to the technology of manufacturing semiconductor two-spectral hybridized assemblies and can be used to create matrix photodetectors (MPD) for various purposes. For the implementation of TTS PSA produce hybridization M×K LSI readings and matrix photosensitive elements (MPSE) and thinning assembly M×K MPSE as a whole with preliminary formation on the front side of the assembly of M×K MPSE grooves of a certain depth. In this case, the separation of the assembly into individual crystals of MPSE occurs through chemical-dynamic thinning to the level of the groove. Further, in one of the manufacturing methods, TTS PSA successively hybridize and disassemble a set of temporary masks (near the surface of the MPSE) using In microcontacts on the assembly M×K LSI readings for spraying through them two multilayer interference filters.

EFFECT: invention solves the problem of manufacturing a thinned two-spectral photosensitive assembly (TTS PSA) with reduced weight and size characteristics.

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