FIELD: physics.
SUBSTANCE: invention can be used for annealing and alloying of plates from semiconductor, ceramic and glass-like materials. Invention consists in that surface of processed material is exposed to pulse laser radiation, wherein material is preheated to temperature, calculated by relationship 
where σLIM is limit tensile strength of material, Pa; C0 is speed of sound in material, m/s; k is module compression, Pa; α is linear expansion coefficient of material, K-1.
EFFECT: reduced maximum tensile stress and preventing spallation destruction of materials on side of irradiated surface.
1 cl, 1 dwg
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