FIELD: radio.
SUBSTANCE: invention can be used for production of radio electronic devices (RED). Amplifier unit (AU) comprises at least one printed circuit board (PCB) on which there is at least one power semiconductor element (PSE), containing heat-removing base (HRB), at least, one chip located on HRB, and outputs for transfer of high-frequency signal, electrically connected with flat conductors arranged on surface of PCB, with formation of matched sections of signal transmission, and heat removing support whereon HRB is installed. In heat-removing support there is dead-end hole in which HRB is fixed by layer of heat-conducting material, completely filling gap between bottom hole and HRB bottom and, at least, partially filling gap between hole and HRB walls. PCB has thickness which enables to perform its elastic deformation. PCB sides corresponding outputs for transfer of high-frequency signal, extend beyond heat-removing support.
EFFECT: technical result is possibility of intensive heat removal from PSE, as well as possibility of operation of RED, which includes AU, in wide temperature range.
4 cl, 10 dwg
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Authors
Dates
2016-05-20—Published
2015-02-17—Filed