FIELD: nanotechnology.
SUBSTANCE: invention relates to deposition of thin films. Vacuum unit for sputtering of films contains main vacuum chamber with processing zone of substrates and a vacuum chamber ablation, tightly connected with main vacuum chamber in zone of processing substrates by outlet branch pipe equipped with inside or on end of sliding shutter for separation in closed position of vacuum chamber ablation and main vacuum chamber. Vacuum chamber for ablation includes an ablation unit and contains at least one drum of targets, which can rotate about its axis, fixed shutter targets, at least one directed target radiator located on periphery of inlet connection pipes, made with possibility of tight attachment of radiators or replacement of their plugs, airlock for servicing drum targets and outlet branch pipe with gas discharge channel. Drum of targets is located under airlock and is protected against ground beams of radiators by fixed flaps. Higher accuracy, purity and efficiency of sputtering.
EFFECT: possibility of conducting process of cleaning substrates simultaneously with process cleaning of targets.
4 cl, 5 dwg
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Authors
Dates
2016-05-20—Published
2014-08-28—Filed