FIELD: technological processes.
SUBSTANCE: invention relates to method for vacuum sputtering of topological pattern of thin-film hybrid microchip on substrate and can be used in microelectronics. Substrate is placed on first mask in first working zone. Create and maintain required vacuum, at least in two working chambers and communicating with them via appropriate vacuum gates of transport zone. After deposition of substrate in first working chamber, with preservation of vacuum, by means of manipulator substrate is separated from first mask. Substrate is moved from first working chamber through transportation zone into second working chamber. Substrate is installed on second mask. Then, second spraying of substrate through second mask is performed.
EFFECT: as result, topological pattern of thin-film of high quality is obtained.
1 cl, 3 dwg
| Title | Year | Author | Number |
|---|---|---|---|
| PLANT FOR VACUUM SPUTTERING OF TOPOLOGICAL PATTERN OF THIN-FILM HYBRID MICROCIRCUIT ON SUBSTRATE | 2014 |
|
RU2590747C2 |
| VACUUM UNIT FOR APPLICATION OF COATINGS | 2008 |
|
RU2471015C2 |
| APPLICATION METHOD OF THIN-FILM COATINGS, AND PROCESS LINE FOR ITS IMPLEMENTATION | 2012 |
|
RU2507308C1 |
| VACUUM TRANSFER DEVICE | 0 |
|
SU1321980A1 |
| METHOD FOR MANUFACTURING MICROWAVE-HYBRID INTEGRATED MICROCIRCUIT FOR SPACE PURPOSES WITH MULTILEVEL COMMUTATION | 2019 |
|
RU2713572C1 |
| MULTILAYER SWITCHING BOARD OF MICROWAVE-HYBRID INTEGRATED MICROCIRCUIT OF SPACE DESIGNATION AND METHOD FOR ITS PRODUCTION (VERSIONS) | 2019 |
|
RU2715412C1 |
| METHOD OF MAKING THIN-FILM MULTILEVEL BOARDS FOR MULTICHIP MODULES, HYBRID INTEGRATED CIRCUITS AND CHIP ASSEMBLIES | 2011 |
|
RU2459314C1 |
| METHOD FOR MANUFACTURING OF MICROCIRCUIT BOARDS WITH MULTI-LEVEL THIN-FILM COMMUTATION | 2009 |
|
RU2398369C1 |
| METHOD FOR PRODUCING MULTILEVEL THIN-FILM INTEGRATED CIRCUITS | 2004 |
|
RU2264676C1 |
| ROTATABLE SUBSTRATE CONTAINER WITH A MASK FOR FORMING THIN FILMS OF VARIOUS CONFIGURATIONS | 2022 |
|
RU2794157C1 |
