FIELD: electricity.
SUBSTANCE: device for chemical-dynamic etching of germanium substrates, including a platform with reaction vessels, configured for orbital motion in horizontal plane, box-shaped and equipped with cylindrical baths, where plates are arranged with substrate upwards, and bath are equipped with covers-sleeves configured for restricting layer thickness of etching agent on surface of plates, wherein bottom of baths is configured for cooling in flowing water, cover-sleeve of each bath is made in form of mixing round flat disc of polypropylene with certain configuration of process holes and sliding along surface of substrate in layer of etching agent due to orbital movement of platform, furthermore, mixing disc is provided with fluoroplastic inserts and holder.
EFFECT: simplified design and improvement of homogeneity of etching.
1 cl, 5 dwg, 1 tbl
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