FIELD: physics.
SUBSTANCE: method of producing the photoelectronic device includes producing a device body, a cathode unit, an electron collector, installing internal parts and units, welding device nodes, loading all units into the high-vacuum installation of the final assembly, pumping the entire system, thermal degassing all units in a vacuum, electronic degassing the MCP and an electron collector in a vacuum, making a photocathode at the cathode unit, sealing the device, unloading photoelectronic devices (FED) from the final assembly. After loading into the high-vacuum installation of the final assembly of the cathode unit, the body with microchannel plates and the electron collector, the body with the MCP and the electron collector is carried from each other and the entire system is pumped to a pressure of not more than 10-8 Pa, thermal degassing all units in a vacuum for, at least, 4 hours at a temperature of 300 to 400°C, the unilateral electronic degassing is performed separately for, at least, 2 hours at a temperature of 0 to 400°C of the electron collector to the electron flow directed to it, and two-sided electron degassing the MCP at the same temperature, for which, for, at least, 2 hours alternately, the excitation sources of the secondary electrons in the MCP placed in front of the input and output of the MCP, are switched on and off, and thereby the electron flow is directed from the input to the output of the MCP and, conversely, from the output to the input of the MCP, synchronously changing the polarity of the voltage between the input to the output of the MCP and gradually increasing the voltage on the MCP and the MCP output current to a level not deteriorating the parameters of the MCP, and then forming the photocathode on the cathode unit, and further, the body with the MCP is mounted on the electron collector, and the cathode unit - on the body, and sealing of the device is performed.
EFFECT: increasing the service life of the photoelectric devices without the ion-barrier film.
2 dwg
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Authors
Dates
2017-07-10—Published
2015-11-27—Filed