FIELD: electricity.
SUBSTANCE: thin-film transistor of low-temperature polycrystalline silicon includes, at least, a gate layer, which is a composite insulating layer comprising, at least, three dielectric layers, the density of each dielectric layer being successively increased in the order, in which they are formed in the manufacturing method. Since the relationship between the density of each layer of the composite insulating layer and the density of its other layers is taken into account in accordance with the present invention, each layer in the composite insulating layer of the thin-film transistor of low-temperature polycrystalline silicon made by the method of the present invention has improved surface contact and conductivity properties of the thin film. The film thickness of each layer in the composite insulating layer is also taken into account.
EFFECT: parasitic capacitance can be effectively reduced and the transistor trigger speed can be increased, by improving the quality of the film formation of the gate layer, the electrical performance and reliability of the thin-film transistor of low-temperature polycrystalline silicon can be improved.
10 cl, 3 dwg
Title | Year | Author | Number |
---|---|---|---|
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE WITH GATE ELECTRODE OF NANOMETRIC LENGTH | 2003 |
|
RU2237947C1 |
SEMICONDUCTOR DEVICE AND METHOD OF ITS MANUFACTURING | 2010 |
|
RU2503085C1 |
MANUFACTURING METHOD OF T-SHAPED GATE | 2016 |
|
RU2624600C1 |
THIN FILM OF LOW-TEMPERATURE POLYCRYSTALLINE SILICON, METHOD OF MANUFACTURE OF SUCH THIN FILM AND TRANSISTOR MADE OF SUCH THIN FILM | 2013 |
|
RU2642140C2 |
METHOD FOR MANUFACTURING SELF-SCALED BIPOLAR CMOS STRUCTURE | 2003 |
|
RU2234165C1 |
METHOD OF MAKING SEMICONDUCTOR DEVICE | 2011 |
|
RU2466476C1 |
PIXEL BLOCK WITH THIN-FILM TRANSISTOR MADE OF LOW-TEMPERATURE POLYCRYSTALLINE SILICON AND METHOD FOR MANUFACTURE THEREOF | 2015 |
|
RU2670219C1 |
METHOD FOR GENERATION OF CMOS-STRUCTURES WITH POLYSILICIC GATE | 1992 |
|
RU2056673C1 |
VERTICAL MIS TRANSISTOR OF INTEGRATED CIRCUIT | 1997 |
|
RU2108641C1 |
MANUFACTURING METHOD OF DIELECTRIC FILM FOR SEMICONDUCTOR STRUCTURES OF ELECTRONIC EQUIPMENT | 2010 |
|
RU2419176C1 |
Authors
Dates
2017-10-23—Published
2014-01-23—Filed