DESIGN OF THIN-FILMED CHIP RESISTIVE HF-ATTENUATOR Russian patent published in 2017 - IPC H01C17/75 

Abstract RU 2638541 C2

FIELD: radio engineering, communication.

SUBSTANCE: resistive HF-attenuator consists of a ceramic plate and resistive and electrically conductive layers applied on it, a resistive layer is made on the ceramic plate first, wherein an electrically conductive layer made in the form of narrow contact pads is located on it, the third one is a dielectric layer with windows located in places of narrow contact pads, the fourth one is an electrically conductive layer which connects with narrow contact pads of the second layer via windows and is made in the form of contact pads of increased area.

EFFECT: increasing the dissipated power and simplifying the technology of manufacturing a resistive HF-attenuator.

1 dwg, 1 tbl

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RU 2 638 541 C2

Authors

Korzh Ivan Aleksandrovich

Kuznetsov Aleksandr Nikolaevich

Dates

2017-12-14Published

2015-11-25Filed