METHOD FOR MANUFACTURING OHMIC CONTACTS Russian patent published in 2018 - IPC H01L21/28 

Abstract RU 2669339 C1

FIELD: technological processes.

SUBSTANCE: invention relates to the formation technology of ohmic contacts to AlGaN/GaN heterostructures and can be used in the manufacture of semiconductor devices, in particular microwave field effect transistors. After the growth of a high-alloy semiconductor material (n+GaN), which is in contact with a two-dimensional electron gas of the AlGaN/GaN heterostructure, and stripping a dielectric mask, high-temperature annealing of the heterostructure with a high-alloyed semiconductor material at a temperature of 600–650 °C for 10–15 minutes in a nitrogen medium.

EFFECT: decrease in the resistivity of ohmic contacts.

1 cl, 1 dwg

Similar patents RU2669339C1

Title Year Author Number
METHOD OF MAKING OHMIC CONTACTS FOR AlGaN/GaN NITRIDE HETEROSTRUCTURES 2015
  • Fedorov Yurij Vladimirovich
  • Pavlov Aleksandr Yurevich
  • Pavlov Vladimir Yurevich
RU2610346C1
METHOD FOR MANUFACTURING A HIGH-CURRENT TRANSISTOR WITH NON-WALL OHMIC CONTACTS 2022
  • Egorkin Vladimir Ilich
  • Bespalov Vladimir Aleksandrovich
  • Zhuravlev Maksim Nikolaevich
  • Zajtsev Aleksej Aleksandrovich
RU2800395C1
METHOD FOR PRODUCING OHMIC CONTACTS TO NITRIDE HETEROSTRUCTURES ON Si/Al BASIS 2016
  • Fedorov Yurij Vladimirovich
  • Pavlov Aleksandr Yurevich
  • Pavlov Vladimir Yurevich
  • Slapovskij Dmitrij Nikolaevich
RU2619444C1
METHOD FOR PRODUCING OHMIC CONTACT WITH LOW SPECIFIC RESISTANCE TO PASSIVATED GALLIUM NITRIDE HETEROSTRUCTURE ON SILICONE SUBSTRATE 2020
  • Bespalov Vladimir Aleksandrovich
  • Pereverzev Aleksej Leonidovich
  • Egorkin Vladimir Ilich
  • Zhuravlev Maksim Nikolaevich
  • Zemlyakov Valerij Evgenevich
  • Nezhentsev Aleksej Viktorovich
  • Yakimova Larisa Valentinovna
RU2748300C1
METHOD OF DRY ETCHING OF NITRIDE LAYERS 2018
  • Pavlov Aleksandr Yurevich
  • Mikhajlovich Sergej Viktorovich
  • Fedorov Yurij Vladimirovich
  • Tomosh Konstantin Nikolaevich
RU2694164C1
METHOD FOR MANUFACTURING A HIGH-POWER MICROWAVE FIELD-EFFECT TRANSISTOR BASED ON A SEMICONDUCTOR HETEROSTRUCTURE BASED ON GALLIUM NITRIDE 2022
  • Rogachev Ilia Aleksandrovich
  • Krasnik Valerii Anatolevich
  • Kurochka Aleksandr Sergeevich
  • Bogdanov Sergei Aleksandrovich
  • Tsitsulnikov Andrei Fedorovich
  • Lundin Vsevolod Vladimirovich
RU2787550C1
METHOD OF MAKING OHMIC CONTACT TO ALGAN/GAN 2018
  • Erofeev Evgenij Viktorovich
  • Fedin Ivan Vladimirovich
  • Fedina Valeriya Vasilevna
RU2696825C1
HETEROSTRUCTURE MODULATED-DOPED FIELD-EFFECT TRANSISTOR 2013
  • Avetisjan Grachik Khachaturovich
  • Dorofeev Aleksej Anatol'Evich
  • Kolkovskij Jurij Vladimirovich
  • Minnebaev Vadim Minkhatovich
RU2534437C1
POWERFUL MICROWAVE FIELD EFFECT TRANSISTOR BASED ON A SEMICONDUCTOR HETEROSTRUCTURE BASED ON GALLIUM NITRIDE 2021
  • Rogachev Ilia Aleksandrovich
  • Krasnik Valerii Anatolevich
  • Kurochka Aleksandr Sergeevich
  • Bogdanov Sergei Aleksandrovich
RU2782307C1
METHOD FOR MANUFACTURING SURFACE ION TRAP 2023
  • Zhuravlev Maksim Nikolaevich
  • Egorkin Vladimir Ilich
RU2806213C1

RU 2 669 339 C1

Authors

Pavlov Aleksandr Yurevich

Pavlov Vladimir Yurevich

Slapovskij Dmitrij Nikolaevich

Dates

2018-10-10Published

2017-06-29Filed